Monitoring the epoxy curing by the dielectric thermal analysis method

IEEE Transactions on Applied Superconductivity

Volumn 14, Issue 2, 2004, Pages 1173-1176

  Shigue, Carlos Y ^a   Dos Santos, Rafaela G S ^a   Baldan, Carlos A ^a   Ruppert Filho, Ernesto ^b  

^a UNIVERSITY OF SÃO PAULO   (Brazil)

^b UNIVERSITY OF CAMPINAS   (Brazil)

Author keywords

Dielectric analysis; Epoxy curing; Thermal analysis

Indexed keywords

CHARACTERIZATION; CROSSLINKING; CURING; DIELECTRIC MATERIALS; EPOXY RESINS; MATRIX ALGEBRA; RESIN TRANSFER MOLDING; RHEOLOGY; SIGNAL PROCESSING; THERMOANALYSIS; VISCOSITY;

DIELECTRIC ANALYSIS; DIELECTRIC THERMAL ANALYSIS (DETA); EPOXY CURING;

SUPERCONDUCTING MAGNETS;

EID: 4344692395     PISSN: 10518223     EISSN: None     Source Type: Journal    
DOI: 10.1109/TASC.2004.830477     Document Type: Conference Paper

References (6)

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