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Volumn 37, Issue 7, 2001, Pages 61-75

Solder joining in electronics

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMOTIVE INDUSTRY; DRILLING; ELECTRONIC EQUIPMENT; INTERNET; MICROPROCESSOR CHIPS; OPTOELECTRONIC DEVICES; PRINTED CIRCUIT BOARDS; VOLATILE ORGANIC COMPOUNDS; WIRELESS TELECOMMUNICATION SYSTEMS;

EID: 0035483684     PISSN: 08887462     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (2)

References (65)
  • 61
    • 0006719352 scopus 로고
    • The effect of power and temperature cycling on Tin/Bismuth and indium solders
    • Association Connecting Electronics Industries, Northbrook, IL
    • (1991) Technical Review , pp. 14
    • Getty, L.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.