Hollow Ag/Pd triangular nanoplate: A novel activator for electroless nickel deposition

Nanotechnology

Volumn 19, Issue 21, 2008, Pages

  Lee, Chien Liang ^a   Tseng, Chun Ming ^a   Wu, Rong Bing ^a   Yang, Ki Long ^a  

^a NATIONAL KAOHSIUNG UNIVERSITY OF APPLIED SCIENCES   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROCHEMISTRY; ELECTROLESS PLATING; NICKEL COMPOUNDS; PALLADIUM COMPOUNDS;

ELECTROCHEMICAL ACTIVITY; ELECTROLESS NICKEL DEPOSITION; GALVANIC DISPLACEMENT REACTION; NANOPLATES;

NANOSTRUCTURED MATERIALS;

NANOMATERIAL; NICKEL; PALLADIUM; SILVER;

ARTICLE; ELECTROCHEMISTRY; GALVANIC CURRENT; PRIORITY JOURNAL;

EID: 43249112485     PISSN: 09574484     EISSN: 13616528     Source Type: Journal    
DOI: 10.1088/0957-4484/19/21/215709     Document Type: Article

References (13)

1. He Y and Shi G 2005 J. Phys. Chem. B 109 17503
2. Dumestre F, Chaudret B, Amiens C, Respaud M, Fejes P, Renaud P and Zurcher P 2003 Angew. Chem. Int. Edn 42 5213
3. Burda C, Chen X, Narayanan R and El-Sayed M A 2005 Chem. Rev. 105 1025
4. Mallory G O and Hajdu J B 1990 Electroless Plating: Fundamentals and Applications (Orlando, FL: American Electroplaters and Surface Finishers Society) pp 207-28
5. Zeller R L 1994 Corrosion 50 457
6. Bayes M, Sinitskaya I, Schell K and House R 1991 Trans. Inst. Met. Finish. 69 140
7. Cui G F, Li N, Li D Y and Li M 2005 J. Electrochem. Soc. 152 C669
8. Hamilton J F and Baetzold R C 1979 Science 205 1213
9. Lee C L, Huang Y C, Wan C C, Wang Y Y, Ju Y J, Kuo L C and Oung J C 2005 J. Electrochem. Soc. 152 C520
10. Lee C L, Huang Y C and Kuo L C 2006 Electrochem. Commun. 8 1021
11. Chen S and Carrol D L 2004 J. Phys. Chem. B 108 5500
12. Bech L, Li Z and Onsgaard J 2007 J. Electron. Spectrosc. Relat. Phenom. 156-158 102
13. Bard A J and Faulkner L R 2001 Electrochemical Methods: Fundamentals and Applications (New York: Wiley) p 725