Surface strengthening of Ti3SiC2 through magnetron sputtering Cu and subsequent annealing

Journal of the European Ceramic Society

Volumn 28, Issue 10, 2008, Pages 2099-2107

  Guo, Haiping ^a,b   Zhang, Jie ^a,c   Li, Fangzhi ^a,c   Liu, Yi ^b   Yin, Jinjie ^b   Zhou, Yanchun ^a  

^a INSTITUTE OF METAL RESEARCH   (China)

^b LIAONING TECHNICAL UNIVERSITY   (China)

^c UNIVERSITY OF CHINESE ACADEMY OF SCIENCES   (China)

Author keywords

Magnetron sputtering; Microhardness; Surface strengthening; Ti3SiC2; Tribological property

Indexed keywords

ANNEALING; GRAIN BOUNDARIES; MAGNETRON SPUTTERING; MICROHARDNESS; SPUTTER DEPOSITION; STRENGTHENING (METAL); TEMPERATURE; TRIBOLOGY; WEAR OF MATERIALS;

MESH STRUCTURE; SURFACE STRENGTHENING;

TITANIUM ALLOYS;

ANNEALING; GRAIN BOUNDARIES; MAGNETRON SPUTTERING; MICROHARDNESS; SPUTTER DEPOSITION; STRENGTHENING (METAL); TEMPERATURE; TITANIUM ALLOYS; TRIBOLOGY; WEAR OF MATERIALS;

EID: 42749087300     PISSN: 09552219     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jeurceramsoc.2008.02.011     Document Type: Article

References (21)

1. 2. J. Am. Ceram. Soc. 79 (1996) 1953-1956
2. 2. J. Am. Ceram. Soc. 80 (1997) 513-516
3. Zhou Y.C., Sun Z.M., Chen S.Q., and Zhang Y. In situ hot pressing/solid-liquid reaction synthesis of dense titanium silicon carbide bulk ceramics. Mater. Res. Innovat. 2 (1998) 142-146
4. N phases: a new class of solids; thermodynamically stable nanolaminates. Prog. Solid State Chem. 28 (2000) 201-281
5. 2. J. Appl. Phys. 83 (1998) 112-119
6. 2 by boronizing treatment. Surf. Coat. Technol. 201 (2006) 6005-6011
7. 2 and TiC. Mater. Res. Innovat. 3 (2000) 286-291
8. 2 composites. Z. Metallkd. 95 (2004) 50-56
9. 2/Ni joints. J. Mater. Res. 9 (2006) 2415-2421
10. 0.06) phase by the diffusion of Si into molten cryolite. J. Electrochem. Soc. 146 (1999) 3919-3923
11. 2 in the 800-1000 °C temperature range. Mater. Sci. Eng. A 298 (2001) 174-178
12. Chan K.Y., Tou T.Y., and Teo B.S. Thickness dependence of the structural and electrical properties of copper films deposited by dc magnetron sputtering technique. Microelectron. J. 37 (2006) 608-612
13. Young R.A. The Rietveld Method (1993), Oxford University Press, Oxford, UK p. 1
14. Musil J., Kunc F., Zeman H., and Polakova H. Relationships between hardness. Young's modulus and elastic recovery in hard nanocomposite coatings. Surf. Coat. Technol. 154 (2002) 304-313
15. Yang C.Y., Jeng J.S., and Chen J.S. Grain growth, agglomeration and interfacial reaction of copper interconnects. Thin Solid Films 420-421 (2002) 398-402
16. x nano-thin films as diffusion barriers between Cu and silicon. Thin Solid Films 484 (2005) 265-271
17. 2 composites. Acta Mater. 55 (2007) 4381-4390
18. Pearson W.B. A Handbook of Lattice Spacing and Structures of Metals and Alloys (1958), Pergamon Press, London p. 949
19. Olesinski R.W., and Abbaschian G.J. Binary Alloy Phase Diagrams. 2nd ed. vol. 2 (1990), ASM International p. 1477
20. Olofinjana A.O., and Atrens A. Properties of rapidly solidified binary copper alloys. Mater. Lett. 31 (1997) 87-92
21. 2. J. Eur. Ceram. Soc. 26 (2006) 2441-2452