Electroless Ni-W-P alloys as barrier coatings for liquid solder interconnects

ESTC 2006 - 1st Electronics Systemintegration Technology Conference

Volumn 1, Issue , 2006, Pages 421-427

  Chen, K ^a   Liu, C ^a   Whalley, D C ^a   Hutt, D A ^a   Li, J F ^b   Mannan, S H ^b  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

^b KING'S COLLEGE LONDON   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROLESS PLATING; ELECTRONICS PACKAGING; METALLIZING; PROTECTIVE COATINGS; REACTION RATES; SOLDERING ALLOYS;

BARRIER COATINGS; LIQUID SOLDER INTERCONNECTS;

NICKEL ALLOYS;

EID: 42549096457     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2006.280037     Document Type: Conference Paper

References (9)

1. Nowottnick, M., Pape, U., Wittke, K., Scheel, W., "Solder joints for high temperature electronics," SMTA International Conf. Proc., Chicago, IL, Sept. 21-25, 2003, pp.693-699.
2. th IEEE Electronic Components and Technology Conf. (ECTC'55), Lake Buena Vista, FL USA, 31st May 2005, pp 441-448.
3. Mannan, S.H., Clode, M.P., "Materials and processes for implementing high-temperature liquid interconnects," IEEE Trans. On Adv. Packaging, Vol. 27, No. 3 (2004), pp. 508-514
4. Pearlstein, F., Weightman, R.F., "Electroless Deposition of Nickel Alloys," Electrochem. Technol., Vol. 6, No. 11-12 (1968), pp. 427-430.
5. Gawrilov, G.G., Chemical (Electroless) Nickel -plating, Portcullis Press, (Redhill 1979), pp. 115-116
6. th International Conference on High Temperature Electronics (HITEN'2005), Paris, France, September, 2005.
7. Aoki, K. and Takano, O., "Electrical Resistance of Electroless Nickel-Tungsten-Phosphorus Alloy Deposits", Plat. Surf. Finish., Vol. 77, No. 3 (1990), pp. 48-52.
8. Jang, J.W., Kim, P.G., Tu, K.N., Frear, D.R., Thompson, P., "Solder reaction-assisted crystallistion of electroless Ni-P under bump metallization in low cost flip chip technology," J. Appl. Phys., Vol. 85, No. 12 (1999), pp. 8456-8463.
9. Jang, J.W., Frear, D.R., Lee, T.Y., Tu, K.N., "Morphology of interfacial reaction between lead-free solders and electroless Ni-P under bump metallization," J. Appl. Phys., Vol. 88, No. 11 (2000), pp.6359-6363.