-
1
-
-
31144448162
-
Design Concept for Wire- Banding Reliability Improvement by Optimizing Position in Power Devices
-
September
-
th International Conference on Power Semiconductors, Prague, 31 August - 3 September 2004, pp 39 44 (2004).
-
(2004)
th International Conference on Power Semiconductors, Prague, 31 August - 3
, pp. 39-44
-
-
Ishiko, M.1
Usui, M.2
Ohuchi, T.3
Shirai, M.4
-
2
-
-
4944221172
-
A Novel Electro-thermal Simulation Approach of Power IGBT modules for automotive traction applications
-
Kitakyushu
-
Takashi Kojima, Yasushi Yamada, Mauro Ciappa, Marco Chiavarini and Wolfgang Fichtner, "A Novel Electro-thermal Simulation Approach of Power IGBT modules for automotive traction applications" Proceeding of 2004 international symposium on power semiconductor devices &ICs, Kitakyushu (2004).
-
(2004)
Proceeding of 2004 international symposium on power semiconductor devices &ICs
-
-
Kojima, T.1
Yamada, Y.2
Ciappa, M.3
Chiavarini, M.4
Fichtner, W.5
-
3
-
-
0031139774
-
Electrothermal Simulation of an IGBT PWM inverter
-
May
-
Alan Mantooth, Allen R.Hefner, "Electrothermal Simulation of an IGBT PWM inverter", IEEE Transaction on Power Electronics, vol. 12, no.3, May (1997).
-
(1997)
IEEE Transaction on Power Electronics
, vol.12
, Issue.3
-
-
Mantooth, A.1
Hefner, A.R.2
-
5
-
-
12544254846
-
Electromagnetic Transient Simulation Models for Accurate Representation of Switching Losses and Thermal Performance in Power Electronic Systems
-
January, 2005
-
D. Rajapakse, A. M. Gole, and P. L. Wilson," Electromagnetic Transient Simulation Models for Accurate Representation of Switching Losses and Thermal Performance in Power Electronic Systems", IEEE Transactions on Power Delivery, vol.20, no.1, January 2005, pp 319-327 (2005).
-
(2005)
IEEE Transactions on Power Delivery
, vol.20
, Issue.1
, pp. 319-327
-
-
Rajapakse, D.1
Gole, A.M.2
Wilson, P.L.3
-
6
-
-
0036755126
-
-
Dewei Xu, Haiwei Lu, Lipei Hang, Satoshi Azuma, Masahiro Kimata, and Ryohel Uchida, Power Loss and Junction Temperature Analysis of Power Semiconductor Devices, IEEE-Transaction- on- Industry Applications, 38, No.5,-pp,-1426-1431,-September/October-(2002).-
-
Dewei Xu, Haiwei Lu, Lipei Hang, Satoshi Azuma, Masahiro Kimata, and Ryohel Uchida," Power Loss and Junction Temperature Analysis of Power Semiconductor Devices", IEEE-Transaction- on- Industry Applications, Vol.38, No.5,-pp,-1426-1431,-September/October-(2002).-
-
-
-
-
7
-
-
42549110813
-
-
Introduction to the 600V ADD-A-pak ™ and INT-A-pak™ IGBT Modules, International Rectifier Application notes (1992).
-
Introduction to the 600V ADD-A-pak ™ and INT-A-pak™ IGBT Modules, International Rectifier Application notes (1992).
-
-
-
-
8
-
-
33947673057
-
Numerical Method for Evaluating IGBT Losses
-
Application Note 7520 Rev. A1
-
Alain Laprade and Ron H. Randal, "Numerical Method for Evaluating IGBT Losses", Application Note 7520 Rev. A1.
-
-
-
Laprade, A.1
Randal, R.H.2
-
9
-
-
42549096609
-
-
Analog Devices: ADMC401 Double Update Mode of PWM generation Unit, Analog Devices, Inc., (1999)
-
Analog Devices: "ADMC401 Double Update Mode of PWM generation Unit", Analog Devices, Inc., (1999)
-
-
-
-
10
-
-
42549119575
-
-
Semikron application notes on heat sink systems
-
Semikron application notes on heat sink systems.
-
-
-
|