A fast modular RLE-based inspection scheme for PCBs

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3203, Issue , 1997, Pages 49-59

  Ercal, F ^a   Bunyak, F ^a   Hao, F ^a   Zheng, L ^a  

^a University of Missouri Rolla   (United States)

Author keywords

Erosion; Gerber format; Image processing; Image segmentation; Morphological operations; Printed circuit board (PCB) inspection; Run length encoding; Space and time complexity

Indexed keywords

CAD FILES; ESSENTIAL FEATURES; GERBER FORMAT; HIGH RESOLUTIONS; IMAGE DATUMS; IMAGE OPERATIONS; INSPECTION SYSTEMS; LARGE IMAGE DATABASES; MORPHOLOGICAL OPERATIONS; OFFLINE; ON-LINE INSPECTIONS; PARALLEL PROCESSING; RUN-LENGTH ENCODING; SPACE AND TIME COMPLEXITY;

DATA STORAGE EQUIPMENT; DIGITAL IMAGE STORAGE; ELECTROMAGNETIC WAVE EMISSION; ELECTRONIC EQUIPMENT MANUFACTURE; ENCODING (SYMBOLS); EROSION; FEATURE EXTRACTION; IMAGE ACQUISITION; IMAGE PROCESSING; IMAGE SEGMENTATION; IMAGING SYSTEMS; INSPECTION; INTELLIGENT CONTROL; INTELLIGENT SYSTEMS; MATHEMATICAL MORPHOLOGY; MERGERS AND ACQUISITIONS; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUITS; SOIL MECHANICS;

PRINTED CIRCUIT BOARDS;

EID: 4244040500     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.294439     Document Type: Conference Paper

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