Automatic screen-printed circuit pattern inspection using connectivity preserving image reduction and connectivity comparison

Proceedings - International Conference on Pattern Recognition

Volumn 1, Issue , 1992, Pages 53-56

  Ninomiya, Takanori ^a   Yoshimura, Kazushi ^a   Nomoto, Mineo ^a   Nakagawa, Yasuo ^a  

^a HITACHI LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER VISION; DEFECTS; IMAGE ENHANCEMENT; INSPECTION; TIMING CIRCUITS;

AUTOMATIC INSPECTION SYSTEM; CERAMIC LAYER; CIRCUIT DEFECT; COMPARISON METHODS; DEFECT DETECTION; IMAGE REDUCTION; PATTERN INSPECTION; SIZE REDUCTIONS;

PRINTED CIRCUITS;

EID: 84919218807     PISSN: 10514651     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICPR.1992.201506     Document Type: Conference Paper

References (8)

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6. T. Ninomiya and Y. Nakagawa, "Automated pattern inspection for unbaked layers of multi-layer ceramic substrates," Proc. of IEEE International Workshop on Machine Vision and Machine Intelligence, pp. 346-351, 1987.
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8. V. B. Bolhouse, "Machine Vision Automates Inspection of Thick-Film Hybrids," IEEE Circuits and Devices Magazine, 2, 1, pp. 44-48, 1986.