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Volumn 391, Issue , 1995, Pages 231-242
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Stress and electromigration
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Author keywords
[No Author keywords available]
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Indexed keywords
DIFFUSION IN SOLIDS;
ELECTRIC CONDUCTORS;
ELECTRIC CURRENTS;
ELECTRIC RESISTANCE;
ELECTRONS;
FAILURE (MECHANICAL);
INTERMETALLICS;
NUCLEATION;
STRESSES;
TENSILE STRENGTH;
ELECTROMIGRATION;
MICROELECTRONICS;
BIASED DIFFUSION;
CURRENT-INDUCED FLUX;
DIFFUSION BARRIER;
FILM CONDUCTORS;
MASS FLUX DIVERGENCE;
METAL ATOMS;
STRESS GRADIENT;
STRESS VOIDING PROBLEM;
VOID NUCLEATION;
ELECTROMIGRATION BEHAVIOR;
ELECTROMIGRATION FAILURES;
MECHANICAL STRESS;
REAL APPLICATIONS;
ELECTROMIGRATION;
STRESSES;
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EID: 0029505344
PISSN: 02729172
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1557/proc-391-231 Document Type: Conference Paper |
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Times cited : (14)
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References (47)
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