An experimental technique for the strain measurement of small structures using pattern recognition

Sensors and Actuators, A: Physical

Volumn 115, Issue 1, 2004, Pages 15-22

  Park, Tae Sang ^a   Baek, Dong Cheon ^a   Lee, Soon Bok ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Dual field of view microscope; Nickel thin film; Patter recognition; Solder joints; Strain measurement

Indexed keywords

FABRICATION; MICROELECTROMECHANICAL DEVICES; PATTERN RECOGNITION; POLYMERS; SILICON COMPOUNDS; STRAIN MEASUREMENT; STRUCTURAL ANALYSIS; TENSILE TESTING;

DUAL FIELD OF VIEW MICROSCOPE; NICKEL THIN FILMS; SOLDER JOINTS;

SEMICONDUCTOR MATERIALS;

EID: 4243121784     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2004.03.028     Document Type: Article

References (9)

1. Sharpe W.N. Jr., Yuan B., Edwards R.L. A new technique for measuring the mechanical properties of thin films. J. Microelectromech. Syst. 6:1997;193-199.
2. Karimi A., Shojaei O.R., Kruml T., Martin J.L. Characterisation of TiN thin films using the bulge test and the nanoindentation technique. Thin Solid Films. 308-309:1997;334-339.
3. 3 substrates studied by X-ray diffraction and bending tests. J. Alloys Compd. 251:1997;37-40.
4. Jiang Z., Lu F.X., Tang W.Z., Wang S.G., Tong Y.M., Huang T.B., Liu J.M. Accurate measurement of fracture toughness of free standing diamond films by three-point bending tests with sharp pre-cracked specimens. Diamond Relat. Mater. 9:2000;1734-1738.
5. 3 ferroelectric thin films. Acta Materialia. 51:2003;3985-3997.
6. Yi T., Kim C.J. Measurement of mechanical properties for MEMS materials. Meas. Sci. Technol. 10:1999;706-716.
7. Moore A.J., Tyrer J.R. Two dimensional strain measurement with ESPI. Opt. Lasers Eng. 24:1996;38-402.
8. S. Greek, F. Ericson, Tensile testing of thin film microstructures, in: Proceedings of the SPIE, Vil. 3324, Austin, TX, USA, 1997, pp. 344-351.
9. W.N. Sharpe Jr., D.A. La Van, R.L. Edwards, Mechanical properties of LIGA-deposited nickel for MEMS transducers, in: Proceedings of the International Conference on Solid-State Sensors and Actuators, Chicago, IL, USA, June 1997, pp. 611-614.