Yield stress and rheological characterization of the low shear zone of an epoxy molding compound for encapsulation of semiconductor devices

Polymer Engineering and Science

Volumn 48, Issue 4, 2008, Pages 747-755

  Yoshii, Masaki ^a  

^a High Performance Materials Department   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

MATHEMATICAL MODELS; RHEOLOGY; SEMICONDUCTOR DEVICES; YIELD STRESS;

CASTRO-MACOSKO EQUATION; EPOXY MOLDING COMPOUNDS (EMC); RHEOLOGICAL CHARACTERIZATION;

SHEET MOLDING COMPOUNDS;

EID: 42249106847     PISSN: 00323888     EISSN: 15482634     Source Type: Journal    
DOI: 10.1002/pen.21015     Document Type: Article

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