Fabrication of three-dimensional network structures by an electrochemical method

Korean Journal of Materials Research

Volumn 18, Issue 3, 2008, Pages 163-168

  Kang, Dae Keun ^a   Heo, Jung Ho ^a   Shin, Heon Cheol ^a  

^a Pusan National University   (South Korea)

Author keywords

Copper; Electrodeposition; Network structure; Tin

Indexed keywords

ACETIC ACID; COALESCENCE; ELECTRODEPOSITION; HYDROPHOBICITY; PORE SIZE; TIN;

METAL SULFATE; NETWORK STRUCTURE;

COPPER;

EID: 42149136355     PISSN: 12250562     EISSN: None     Source Type: Journal    
DOI: 10.3740/MRSK.2008.18.3.163     Document Type: Article

References (16)

1. J. W. Long, C. P. Rhodes, A. L. Young and D.R. Rolison, Nano Letters, 3, 1155 (2003).
2. J. S. Sakamoto and B. Dunn, J. Mater. Chem., 12, 2859 (2002).
3. S. Ranganathan, R. McCreery, S. M. Maji and M. Madou, J. Electrochem. Soc., 147, 277 (2000).
4. H. C. Shin, J. Dong and M. Liu, Adv. Mater., 15(19), 1610 (2003).
5. H. C. Shin and M. Liu, Adv. Funct. Mater., 15(4), 582 (2005).
6. H. C. Shin and M. Liu, Chem. Mater., 16(25), 5460 (2004).
7. M.G. Fontana, Corrosion Engineering, 3rd ed., p.445, McGraw-Hill, New York, USA (1987).
8. D. A. Jones, Principles and Prevention of Corrosion, 2nd ed., p.75, Prentice Hall, New Jersey, USA (1996).
9. V. S. J. Craig, B. W. Ninham and R.M. Pashley, J. Phys. Chem., 97, 10197 (1993).
10. V. S. J. Craig, B. W. Ninham and R. M. Pashley, Nature, 364, 317 (1993).
11. L. A. Deschenes, J. Barrett, L. J. Muller, U. Mohanty and J. T. Fourkas, J. Phys. Chem., B101, 5777 (1997).
12. L. A. Deschenes, J. Barrett, L. J. Muller, J. T. Fourkas and U. Mohanty, J. Phys. Chem., B102, 5115 (1998).
13. M. Paunovic and M. Schlesinger, Fundamentals of Electrochemical Deposition, 2nd ed., p.209, Wiley-Inter-science, New Jersey, USA (2006).
14. J.H. White and H.D. Abruna, J. Electroanal. Chem., 300, 521 (1991).
15. E. Herrero and H.D. Abruna, Langmuir, 13, 4446 (1997).
16. T. Fukuda and A. Aramata, J. Electroanal. Chem., 467, 112 (1999).