Low-cost, high-density optical parallel link modules and optical backplane for the last 1 meter regime applications

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6897, Issue , 2008, Pages

  Mikawa, Takashi ^a  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

Author keywords

40,100 GbEther systems; High density; Intra box; Low cost; Monolithic VCSEL; Optical backplane; Optical coupling; Optical parallel link module; Packaging; Self alignment

Indexed keywords

CHEMICAL MODIFICATION; COMPUTER NETWORKS; ELECTRONICS INDUSTRY; FIBER OPTIC SENSORS; INTEGRATED CIRCUITS; MICROELECTRONICS; MICROFLUIDICS; MULTIMODE FIBERS; OPTICAL INTERCONNECTS; OPTICS; SEMICONDUCTING SILICON COMPOUNDS; ELECTRONICS PACKAGING; OPTICAL LINKS; OPTOELECTRONIC DEVICES;

(060.2410) FIBERS; BACK PLANES; COUPLING TECHNOLOGY; HIGH INDEX CONTRAST (HIC); HIGH-DENSITY; MULTI MODES; NOVEL COMPONENT; OPTICAL (PET) (OPET); OPTICAL BACKPLANE; OPTICAL COUPLINGS; OPTO ELECTRONIC INTEGRATED CIRCUITS (OEIC); OPTOELECTRONIC PACKAGING; SELF ALIGNMENT (SA); GBETHER SYSTEMS; OPTICAL COUPLING;

TECHNOLOGY; DENSITY (OPTICAL);

EID: 42149127566     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.768583     Document Type: Conference Paper

References (20)

1. Optoelectronic Industry and Technology Development Association(OITDA) report, p.30,2006(in Japanese).
2. Rich Warmke,'"Rambus Memory Interface Technology," RAMBUS DEVELOPER FORUM JAPAN, July, 2005.
3. Alexei L.Glebov, M.G.Lee,K.Yokouchi, "Integration technologies for pluggable backplane optical interconnect systems," Optical Engineering 46(1),p.015403-1,2007.
4. E.Bosman,G.Van Steenberge,P.Geerinck,W.Christiaens,J.Vanfleteren and P.Van Daele,"Embedding of Optical Interconnections in Flexible Electronics," Proc. of 57th ECTC,p.1281, 2007.
5. B.J.Offrein,C.Berger,R.Beyeler,R.Dangel,L.Dellmann,F.Horst,T.Lamprecht,N. Meier,J.Kash,"High bandwidth board-level parallel optical interconnects for server applications," Proc. of 32th ECOC, We4.2.1, 2006.
6. D.Guidotti, J.Yu, M.Blaser, V.Grundlehner and G.K.Chang,"Edge Viewing Photodetectors for Strictly In-plane Lightwave Circuit Integration and Flexible Optical Interconnects," Proc. of 56th ECTC, p.782, 2006.
7. R.T.Chen, J.Choi, L.Wang, H.Bi, "Recent Advances of Chip-to-Chip Optical Interconnect Systems," 16th LEOS HSD Workshop Notes,TuB4, 2005.
8. http://io.intec.ugent.be/publications.html, "Parallel optical interconnects with on-chip optical access," SPIE Photonics Europe, 2004.
9. M.A.Shahid and WR.Holland, "Flexible Optical Backplane Interconnections," Proc. of MPPOI, p. 178, 1996.
10. A. SUZUKI, K. SUZUKI, Y. WAKAZONO, S. SUZUKI, T. YAMAGUCHI, H. MASUDA, K. SAITO, M.KINOSHITA, O.IBARAGI, K. KIKUCHI, H.NAKAGAWA, Y. OKADA, and M. AOYAGI, " Signal Transmission Evaluation of Optical Backplane Model with 10-Gbit/s Optical Transmitter and Receiver Module," IEICE, Vol.J89-C, p. 796 ,2006(in Japanese).
11. A. Suzuki, K. Suzuki, Y Wakazono, S. Suzuki, T Yamaguchi, H. Masuda, K. Saito, M. Kinoshita, O. Ibaragi, K. Kikuchi, H. Nakagawa, Y. Okada, and M. Aoyagi, "Low-cost and high-density 10Gbps/ch optical parallel link module for multi-terabit router application," Proc. of 32th ECOC, We.4.2.3, 2006.
12. V.Sharma, "Advanced Telecommunications Computing Architecture and micro TCA Next Generation Standards based Network Equipment High Speed Interconnect," 16th LEOS HSD Workshop Notes,TuA4, 2005.
13. I.Hatakeyama,K.Miyoshi,J.Sasaki,K.Yamamoto,M.Kurihara,T.Watanabe,J. Ushioda,Y.Hashimoto,R.Kuribayashi, and K.Kurata, "A 400 Gbps Backplane Switch with 10 Gbps/port Optical I/O Interfaces," Proc. of the SPIE, Vol. 6014,158,2005.
14. D.M.Kuchta,Y.H.Kwark,C.Schuster,C.Baks,C.Haymes,J.Schaub,P.Pepeljugoski, L.Shan,R.John,D.Kucharski, D.Rogers,M.Ritter,J.Jewell,L.A.Graham,K,Schroedinger, A.Schild and Hans-Martin Rein,"120-Gb/s VCSEL-Based Parallel-Optical Interconnect and Custom 120-Gb/s Testing Station," IEEE J.Lightwave Tech.22, p.2200,2004.
15. http://www.ieee802.org/3/hssg/index.html.
16. P. K. Pepeljugoski, "Emerging 100GE Standards and Challenges," 18th LEOS HSD Workshop Notes, MAl, 2007.
17. to be presented in SPIE Photonics West 2008.
18. T. Suzuki, Y. Wakazono, A.Suzuki, T. Ishikawa, H. Masuda, Y. Hashimoto, K. Kikuchi, M. Tamura, H. Nakagawa, M. Aoyagi, and T. Mikawa, "13Gbps Multi Wavelength CWDM Monolithic VCSELs for High Density Packaging," Proc. of 13th MOC, PD2, 2007.
19. to be published in IEEE Photonics Technology Letters.
20. Optoelectronic Industry and Technology Development Association(OITDA) report, 2004FY-009-1,p.5,2005 (in Japanese).