Low-loss and broadband BGA package transition for LTCC-SIP applications

Microwave and Optical Technology Letters

Volumn 50, Issue 4, 2008, Pages 1036-1040

  Kangasvieri, T ^a   Halme, J ^a   Vahakangas J ^a   Lahti, M ^b  

^a UNIVERSITY OF OULU   (Finland)

^b VTT TECHNICAL RESEARCH CENTRE OF FINLAND   (Finland)

Author keywords

BGA; Broadband; LTCC; System in Package; Transition

Indexed keywords

CERAMIC MATERIALS; ELECTRONICS PACKAGING; EQUIVALENT CIRCUITS; INSERTION LOSSES; SOLDERING;

SYSTEM-IN-PACKAGE; TRANSITION PATH;

BALL GRID ARRAYS;

EID: 41849131462     PISSN: 08952477     EISSN: None     Source Type: Journal    
DOI: 10.1002/mop.23276     Document Type: Article

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