Solar wafer slicing with loose and fixed grains

Conference Record of the 2006 IEEE 4th World Conference on Photovoltaic Energy Conversion, WCPEC-4

Volumn 1, Issue , 2006, Pages 948-951

  Kray, D ^a   Schumann, M ^a   Eyer, A ^a   Willeke, G P ^a   Kubler R ^b   Beinert, J ^b   Kleer, G ^b  

^a FRAUNHOFER INSTITUTE FOR SOLAR ENERGY SYSTEMS ISE   (Germany)

^b FRAUNHOFER INSTITUTE FOR MECHANICS OF MATERIALS IWM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COSTS; DIAMOND CUTTING TOOLS; GRAIN BOUNDARIES; POLYETHYLENE GLYCOLS; SOLAR CELLS;

MONODIRECTIONAL WIRE MOVEMENT; SAWING METHODS; SOLAR SILICON WAFERS; WATER-BASED SLURRY;

SILICON WAFERS;

EID: 41749114294     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/WCPEC.2006.279613     Document Type: Conference Paper

References (4)

1. G. P. Willeke and D. Kray. "A new route towards 50 pm thin crystalline silicon wafer solar cells". Proc. of the 17th EU-PVSEC, Munich, Germany, p1621.
2. PHOTON International magazine, issue May 2000
3. th Workshop on Crystalline Silicon Solar Cells and Modules: Materials and Processes, Vail, Colorado, 2005, p267
4. D. Schneider, E. Stiehl et al., "Nondestructive Testing of Damage Layers in Semiconductor Materials by Surface Acoustic Waves", Design, Process Integration, and Characterization for Microelectronics, Santa Clara, CA, USA, 6-7 March 2002, Proc. of the SPIE - The International Society for Optical Engineering, USA, vol. 4692 (2002), p 195-211