An intelligent high-speed 3D data registration integrated circuit applied to large array format inkjet printhead

Proceedings of 1st IEEE International Conference on Nano Micro Engineered and Molecular Systems, 1st IEEE-NEMS

Volumn , Issue , 2006, Pages 368-372

  Liou, Jian Chiun ^a   Tseng, Fan Gang ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

3D architecture; ASIC; Inkjet printhead

Indexed keywords

CMOS INTEGRATED CIRCUITS; DROPS; FLUID MECHANICS; INK; INTEGRATED CIRCUITS; MANAGEMENT INFORMATION SYSTEMS; MOLECULES; MULTIPLEXING; NEMS; NOZZLES; OPTICAL DESIGN; RESISTORS; SHIFT REGISTERS; SPEED; TELECOMMUNICATION; THERMAL PRINTING;

(+ MOD 2N) OPERATION; (E ,3E) PROCESS; 3 DIMENSIONAL; 3D DATA; APPLIED (CO); DATA ACCESSING; DATA MANAGEMENT (DM); DROP VOLUME; DROPLET EJECTION; EXPERIMENT RESULTS; HIGH SPEEDS; INK JET PRINTHEADS; INTERNATIONAL CONFERENCES; LARGE ARRAYS; MOLECULAR SYSTEMS; MULTIPLEXER (MUX); NOVEL ARCHITECTURE; NUMBER OF DATA (ND); POWER SUPPLIES; PRINT HEADS; SCANNING SPEED; SCANNING TIME; SIGNAL TRANSMISSIONS; THREE DIMENSIONS;

SCANNING;

DATA PROCESSING; ELECTRIC CIRCUITS; FLUID MECHANICS; INK JET PRINTING; NOZZLES; SCANNING; TELECOMMUNICATIONS;

EID: 41649091199     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/NEMS.2006.334760     Document Type: Conference Paper

References (8)

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