Model based layout pattern dependent metal filling algorithm for improved chip surface uniformity in the copper process

Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC

Volumn , Issue , 2007, Pages 1-6

  Sinha, Subarna ^a   Luo, Jianfeng ^a   Chiang, Charles ^a  

^a SYNOPSYS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOOLEAN FUNCTIONS; COMPUTER AIDED DESIGN; COPPER; COPPER ALLOYS; DEPOSITS; DIGITAL INTEGRATED CIRCUITS; INDUSTRIAL ENGINEERING; MECHANIZATION; NANOTECHNOLOGY;

(E ,3E) PROCESS; (O-SEC.-BUTYLDITHIOCARBONATIO-S ,S') COPPER; CHIP SURFACES; CHIP YIELD; COPPER DAMASCENE PROCESS; DAMASCENE PROCESSING; DESIGN AUTOMATION CONFERENCE (DAC); EXPERIMENTAL RESULTS; KEY INDICATORS; METAL FILLING; MODEL BASED (OPC); PATTERN DEPENDENT; PHYSICAL MECHANISMS; SHARP CONTRAST; SOUTH PACIFIC;

METALS;

EID: 41549101015     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ASPDAC.2007.357783     Document Type: Conference Paper

References (11)

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