Full wave simulation of SAW filter package and SAW pattern inside package

Proceedings of the IEEE Ultrasonics Symposium

Volumn 2, Issue , 2003, Pages 2089-2092

  Lin, Shin Hung ^a   Lin, Ken Huang ^a   Chiu, Shih Chen ^b   Chen, Chi Yun ^b  

^a NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

^b TAI SAW Technology Co Ltd   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; APPROXIMATION THEORY; BONDING; COMPUTER SIMULATION; ELECTROMAGNETISM; FREQUENCIES; SUBSTRATES;

BOND WIRES; COUPLING EFFECTS; FILTER PACKAGES; FILTER PATTERNS;

ACOUSTIC SURFACE WAVE FILTERS;

EID: 4143050530     PISSN: 10510117     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. T. Makkonen, V. P. Plessky, S. Kondratiev, and M. M. Salomaa, "Electromagnetic Modeling of Package Parasitics in SAW-Duplexer," IEEE Ultrasonics Symposium, 1996.
2. T. Makkonen, S. Kondratiev, V. P. Plessky, T. Thorvaldsson, J. Koskela, J. V. Knuuttila, and M. M. Salomaa, "Surface Acoustic Wave Impedance Element ISM Duplexer· Modeling and Optical Analysis," IEEE Trans. On Ultrasonics, Ferroelectrics, and Frequency Control, vol.48, no.3, May 2001.
3. H Yatsuda, "Modeling of parasitic effects for flip-chip saw filters," IEEE Ultrasonics Symposium, Vol.1, pp. 143-146, 1997.
4. C. Finch, X. Yang, T. Wu, and B. Abbott, "Full-Wave Analysis of RF SAW Filter Packaging," IEEE Ultrasonics Symposium, vol.1, pp. 81-84, 2001.