Preparation and thermal property analysis of Ag-Cu-In-Sn nano-powder

Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering

Volumn 37, Issue 2, 2008, Pages 330-333

  Yan, Xiuwen ^a,b   Qiu, Tai ^b   Li, Liangfeng ^b   Zhang, Zhenzhong ^b  

^a CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION   (China)

^b NANJING TECH UNIVERSITY   (China)

Author keywords

Ag Cu In Sn; DC arc plasma; Thermal analyses

Indexed keywords

COPPER ALLOYS; DIFFERENTIAL SCANNING CALORIMETRY; INDIUM ALLOYS; MELTING POINT; NANOSTRUCTURED MATERIALS; PARTICLE SIZE; THERMODYNAMIC PROPERTIES; THERMOGRAVIMETRIC ANALYSIS; TIN ALLOYS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

DC ARC PLASMA; NANOPOWDER; THERMAL PROPERTIES;

SILVER ALLOYS;

EID: 41349112486     PISSN: 1002185X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (12)

1. Tong Xunyuan. Rare Metal Materials and Engineering[J], 2003, 32(3): 208.
2. Jiang Yu, Liu Ming, Yang Yanmin et al. Rare Metal Materials and Engineering[J], 2005, 34(3): 475.
3. Wei Zhiqiang, Qiao Hongxia, Dai Jianfeng et al, Rare Metal Materials and Engineering[J], 2005, 34(9): 1415.
4. Yang Mingchuan, Xu Jian, Sun Xiukui et al. Acta Metallurgica Sinica[J], 1994, 30(6): 254.
5. Wang Yi, Cui Zuolin, Zhang Zhikun. Rare Metal Materials and Engineering[J], 2005, 34(20): 309.
6. Yan Xiuwen, Zhang Zhenzhong, Qiu Tai. Foundry Technology[J], 2005, 26(11): 1058.
7. Li Xingguo, Liao Fuhui. The Chinese Journal of Process Engineering[J], 2002, 12(4): 295.
8. Yuan Xingqiu, Li Hui, Zhao Taizhe et al. Chinese Physics Society[J], 2004, 53(11): 140.
9. Dong X L, Zhang Z D, Zhao X G et al. Journal of Materials Research[J], 1999, 14(2): 398.
10. Zhang Lide, Mou Jimei. Nanomaterial and Nanostructure[M]. Beijing: Science Press, 2001: 68.
11. Chin C L, William W S. Thin Solid Films[J], 2000, 366(6): 196.
12. Liu Wei, Deng Xiaoyan, Zhang Zhikun. PTCA (Part A: Physical Testing)[J], 2004, 40(2): 64.