Microstructure and properties of (AgCu28)80InxSn(20-x) alloys

Zhuzao Jishu/Foundry Technology

Volumn 26, Issue 11, 2005, Pages 1058-1060

  Yan, Xiu Wen ^a   Zhang, Zhen Zhong ^a   Qiu, Tai ^a  

^a NANJING TECH UNIVERSITY   (China)

Author keywords

Melting properties; Microstructure; Solder; Spreadability

Indexed keywords

EID: 28744437520     PISSN: 10008365     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (6)