A universal performance chart for CPU cooling devices

Heat Transfer Engineering

Volumn 29, Issue 7, 2008, Pages 651-656

  Ng, Kim Choon ^a   Yap, Christopher R ^a   Chan, Mark Aaron ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING SYSTEMS; INTEGRATED CIRCUITS; PARAMETER ESTIMATION; THERMAL EFFECTS; WAFER BONDING;

HEAT REMOVAL;

PROGRAM PROCESSORS;

EID: 41249104099     PISSN: 01457632     EISSN: 15210537     Source Type: Journal    
DOI: 10.1080/01457630801922618     Document Type: Article

References (13)

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