Study of mechanical properties of amorphous copper with molecular dynamics simulation

Chinese Physics B

Volumn 17, Issue 1, 2008, Pages 259-263

  Wang, Guang Hai ^a   Pan, Hui ^a   Ke, Fu Jiu ^a,b   Xia, Meng Fen ^b,c   Bai, Yi Long ^b  

^a BEIHANG UNIVERSITY   (China)

^b INSTITUTE OF MECHANICS   (China)

^c PEKING UNIVERSITY   (China)

Author keywords

Amorphous; Molecular dynamics; Shear; Strain rate effect; Tension

Indexed keywords

AMORPHOUS MATERIALS; MECHANICAL PROPERTIES; MOLECULAR DYNAMICS; STRAIN RATE;

AMORPHOUS COPPER; NUMBER DENSITY;

COPPER COMPOUNDS;

EID: 41249085321     PISSN: 16741056     EISSN: None     Source Type: Journal    
DOI: 10.1088/1674-1056/17/1/045     Document Type: Article

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