|
Volumn 15, Issue 3, 2006, Pages 610-617
|
Investigation on quenching at a high-angle Cu grain boundary on an atomic scale
|
Author keywords
Crystal; Interface; Molecular dynamics; Solidification
|
Indexed keywords
COMPUTER SIMULATION;
COPPER;
CRYSTALS;
GRAIN BOUNDARIES;
LOW TEMPERATURE EFFECTS;
QUENCHING;
SOLIDIFICATION;
CU GRAIN BOUNDARY;
INTERFACES;
MELTING INTERFACE;
MOLECULAR DYNAMICS SIMULATIONS;
MOLECULAR DYNAMICS;
|
EID: 33644648333
PISSN: 10091963
EISSN: 17414199
Source Type: Journal
DOI: 10.1088/1009-1963/15/3/028 Document Type: Article |
Times cited : (18)
|
References (32)
|