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Volumn 15, Issue 3, 2006, Pages 610-617

Investigation on quenching at a high-angle Cu grain boundary on an atomic scale

Author keywords

Crystal; Interface; Molecular dynamics; Solidification

Indexed keywords

COMPUTER SIMULATION; COPPER; CRYSTALS; GRAIN BOUNDARIES; LOW TEMPERATURE EFFECTS; QUENCHING; SOLIDIFICATION;

EID: 33644648333     PISSN: 10091963     EISSN: 17414199     Source Type: Journal    
DOI: 10.1088/1009-1963/15/3/028     Document Type: Article
Times cited : (18)

References (32)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.