Optoelectronic packaging based on laser joining

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6880, Issue , 2008, Pages

  Eberhardt, Ramona ^a   Beckert, Erik ^a   Burkhardt, Thomas ^a   Böhme, Steffen ^a   Schreiber, Thomas ^a   Tünnermann, Andreas ^a  

^a FRAUNHOFER INSTITUTE FOR APPLIED OPTICS AND PRECISION ENGINEERING   (Germany)

Author keywords

High power laser; Micro assembly; Packaging; Soldering; Splicing

Indexed keywords

ADHESIVES; OPTOELECTRONIC DEVICES; SILICON WAFERS;

LASER JOINING; OPTOELECTRONIC PACKAGING; WAFER LEVEL BONDING;

FIBER LASERS;

EID: 41149173614     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.763105     Document Type: Conference Paper

References (5)

1. A.D. Yablon, Optical Fiber Fusion Splicing, Springer-Verlag, Berlin & Heidelberg, 2005.
2. Crystal Fibre A/S, Towards 100kW fiber laser systems, White paper, published February 28th 2006.
3. R. Eberhardt et al., "New Packaging Concepts for High Power Fiber Laser Systems", 3. Fiber Laser Workshop, Dresden, 14.-15. Nov. 2007.
4. H. Banse, R. Eberhardt, E. Beckert and W. Stöckl, "Laser Beam Soldering - a New Assembly Technology for Microoptical Systems", Microsystems Technologies 11, 2005, pp.186-193.
5. Th. Teutsch, E. Zakel and G. Azdasht, "Pulsed-laser Heating for Flip Chip Assembly", Advanced Packaging, pp. 40-43, Pennwell Corp., May/June 2006.