Effect of P/Si polymeric silsesquioxane and the monomer compound on thermal properties of epoxy nanocomposite

European Polymer Journal

Volumn 44, Issue 4, 2008, Pages 1003-1011

  Chiu, Yie Chan ^a   Ma, Chen Chi M ^a   Liu, Fang Yi ^a   Chiang, Chin Lung ^b   Riang, Linawati ^a   Yang, Jeng Cheng ^c  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b HUNGKUANG UNIVERSITY   (Taiwan)

^c CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

Epoxy nanocomposite; Polysilsesquioxanes; Sol gel method; Thermal properties

Indexed keywords

EPOXY RESINS; MOLECULAR STRUCTURE; NUCLEAR MAGNETIC RESONANCE SPECTROSCOPY; SOL-GEL PROCESS; SOLID STATE REACTIONS; THERMODYNAMIC PROPERTIES;

CHARACTERISTIC INTENSITY; EPOXY NANOCOMPOSITE; POLYSILSESQUIOXANES;

NANOCOMPOSITES;

EID: 41049089823     PISSN: 00143057     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.eurpolymj.2008.01.033     Document Type: Article

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