Concepts for hybrid micro assembly using hot melt joining

IFIP International Federation for Information Processing

Volumn 260, Issue , 2008, Pages 161-169

  Rathmann, Sven ^a   Raatz, Annika ^a   Hesselbach, Jürgen ^a  

^a TECHNICAL UNIVERSITY OF BRAUNSCHWEIG   (Germany)

Author keywords

Heat management concept; Hot melt adhesives; Precision joining operations

Indexed keywords

BATCH DATA PROCESSING; COATINGS; GRIPPERS; HOT MELT ADHESIVES; MICROMACHINING; MICROOPTICS;

ADHESIVE TECHNOLOGY; COATED COMPONENTS; COLLABORATION RESEARCHES; HEAT MANAGEMENT; HYBRID INTEGRATION; JOINING TECHNIQUES; PRECISION JOINING OPERATIONS; SINGLE COMPONENTS;

JOINING;

EID: 40949117223     PISSN: 15715736     EISSN: None     Source Type: Book Series    
DOI: 10.1007/978-0-387-77405-3_15     Document Type: Conference Paper

References (6)

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3. S. Böhm, et Al., Micro Bonding with non-viscous adhesives. In: Microsystem Technologies 12(7), pp. 676-679 (2006).
4. S. Böhm, et Al., Micro Bonding using hot melt adhesives. Journal of Adhesion and Interface. The Society of Adhesion & Interface 7(4), pp. 28-31 (2006).
5. B. Lotter and H.-P. Wiendahl, (editors), Montage in der indusriellen Produktion - Ein Handbuch für die Praxis. Springer Verlag Berlin Heidelberg, ISBN 3-540-21413-5 (2006).
6. R. Hull, Properties of Crystalline Silicon. Emis DataReviews Series No. 20, INSPEC, IEE, London, UK (1999).