Heat treatment-induced bond layer diffusion and re-crystallization in copper carbon interface systems measured by modulated IR radiometry

European Physical Journal: Special Topics

Volumn 153, Issue 1, 2008, Pages 391-394

  Chotikaprakhan, S ^a,b   Haj Daoud, A ^a,c   Neubauer, E ^d   Pelzl, J ^a   Bein, B K ^a   Meckenstock, R ^a,e  

^a RUHR UNIVERSITY BOCHUM   (Germany)

^b KASETSART UNIVERSITY   (Thailand)

^c Palestine Academy for Science and Technology   (Palestine)

^d ARC SEIBERSDORF RESEARCH GMBH   (Austria)

^e UNIVERSITY OF DUISBURG ESSEN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 40949113261     PISSN: 19516355     EISSN: 19516401     Source Type: Journal    
DOI: 10.1140/epjst/e2008-00469-5     Document Type: Conference Paper

References (5)

1. E. Neubauer, G. Korb, C. Eisenmenger-Sittner, H. Bangert, S. Chotikaprakhan, D. Dietzel, A.M. Mansanares, B.K. Bein, Thin Solid Films 433, 160 (2003)
2. J.L. Nzodoum Fotsing, J. Gibkes, J. Pelzl, B.K. Bein, J. Appl. Phys. 98, 063522 (2005)
3. K.H. Junge, J.L. Nzodoum Fotsing, A. Haj-Daoud, J. Gibkes, R. Meckenstock, J. Pelzl, B.K. Bein, Eur. Phys. J. Special Topics 153, 321 (2008)
4. S. Chotikaprakhan, Ph.D. thesis, Faculty of Physics and Astronomy, Ruhr-University Bochum, 2007
5. B. Schwarz, C. Schrank, C. Eisenmeger-Sittner, M. Stöger-Pollach, M. Rosner, E. Neubauer, Surf. Coat. Technol. 200, 4891 (2006)