UV/heat dual-curable adhesive tapes for fabricating stacked packages of semiconductors

Journal of Applied Polymer Science

Volumn 108, Issue 2, 2008, Pages 1178-1183

  Saiki, Naoya ^a   Yamazaki, Osamu ^a   Ebe, Kazuyoshi ^a  

^a LINTEC CORPORATION   (Japan)

Author keywords

Adhesion; Irradiation; Modulus; Monomers; Thermosets

Indexed keywords

ACRYLIC MONOMERS; EPOXY RESINS; FUNCTIONAL GROUPS; METHANOL; VISCOELASTICITY;

NEOPENTYLGLYCOL DIACRYLATE; TRIMETHYLOLPROPANE TRIACRYLATE;

SEMICONDUCTOR MATERIALS;

ADHESIVE AGENT; CURING (CHEMISTRY); EPOXY RESIN; MONOMER; POLYACRYLATE; ULTRAVIOLET RADIATION;

EID: 40949101452     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.27663     Document Type: Article

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