Effects of sintering atmospheres and non-stoichiometry on wetting and interfacial bonding of titania with liquid copper

Materials Letters

Volumn 62, Issue 14, 2008, Pages 2110-2113

  Li, Jian Guo ^a  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

Copper; Non stoichiometry; Sintering atmosphere; Titania; Wetting; Work of adhesion

Indexed keywords

CHEMICAL BONDS; COPPER; SINTERING; STOICHIOMETRY; WETTING;

INTERFACIAL BONDING; SINTERING ATMOSPHERE;

TITANIUM DIOXIDE;

EID: 40649111395     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2007.11.037     Document Type: Article

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