Evaluation of a fast and flexible OPC package: OPTISSIMO

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 2884, Issue , 1996, Pages 412-418

  Maurer, Wilhelm ^a   Waas, Thomas ^b   Eisenmann, Hans ^b  

^a Semiconductor Technology Center   (Germany)

^b aiss GmbH   (Germany)

Author keywords

IC design data handling; Mask data preparation; OPC; Optical lithography

Indexed keywords

DESIGN; INTEGRATED CIRCUITS; LINEWIDTH; MASKS; PHOTOLITHOGRAPHY;

ART DESIGNS; CHIP DESIGNS; CURRENT STATES; DATA COMPLEXITIES; DUV LITHOGRAPHIES; EVALUATION RESULTS; GATE LEVELS; HIERARCHICAL DATUMS; IC DESIGN DATA HANDLING; LINEWIDTH VARIATIONS; MASK DATA PREPARATION; NON LINEARITIES; OPC; OPTICAL LITHOGRAPHY; PROXIMITY CORRECTIONS; PROXIMITY EFFECTS; REASONABLE TIMES;

DATA HANDLING;

EID: 4043183626     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.262826     Document Type: Conference Paper

References (5)

1. W. Maurer, K. Satoh, DJ. Samuels, T. Fischer, "Pattern transfer at k1 = 0.5: get 0.25 μm lithography ready for manufacturing", Optical Microlithography IX, SPIE 2726, p. 113, 1996
2. J. Garofalo, O. Otto et al., "Automated layout of mask assist-features for realizing 0.5 k1 ASIC lithography", Optical Microlithography IX, SPIE 2440, p. 302, 1995
3. M.L. Rieger and J.P. Stirniman , "Customizing proximity correction for process-specific objectives", Optical Microlithography iX, SPIE 2726, p. 651, 1996
4. N.B. Cobb, A. Zakhor, E. Miloslavsky, "Mathematical and CAD framework for proximity correction", Optical Microlithography IX, SPIE 2726, p. 208, 1996
5. H. Eisenmann, T. Waas, H. Hartmann, "PROXECCO - Proximity effect correction by convolution", J. Vac. Sci. Technol. B 11(6), p. 2741, 1993