SCOPUS 정보 검색 플랫폼

Volumn , Issue , 2003, Pages 645-650

The development of defect free post-CMP cleaning in Cu/low-k damascene wiring

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; COPPER; HYDROPHILICITY; HYDROPHOBICITY; PERMITTIVITY; SURFACE PROPERTIES;

DAMASCENE WIRING; DEFECT COUNT; HYDROPHOBIC SURFACE; POST-CMP CLEANING;

ELECTRIC WIRING;

EID: 4043120567 PISSN: 15401766 EISSN: None Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper

Times cited : (3)

References (8)

1
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- (2002) Proceedings of 2002 IITC , pp. 105-107
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2
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- A manufacturable copper/low-k SiOC/SiCN process technology for 90nm-node high performance eDRAM
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3
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- Low stress polishing of copper/low-k dielectric structure
- R. K.Singh and S.-M. Lee, Low Stress Polishing of Copper/Low-k Dielectric Structure, (2003), Proceedings of 2003 CMP-MIC Conference, pp128-132
- (2003) Proceedings of 2003 CMP-MIC Conference , pp. 128-132
- Singh, R.K.¹ Lee, S.-M.²

4
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- A 90nm copper CMP prcess with low defectivity using optimizing copper and barrier removal slurries
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- (2003) Proceedings of 2003 CMP-MIC Conference , pp. 257-267
- Gopalan, P.¹ Buley, T.² Kulus, M.³

5
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- Improved Cu abrasive-free polishing for 90nm node process
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- (2003) Proceedings of 2003 CMP-MIC Conference , pp. 301-307
- Yamada, Y.¹ Terazaki, H.² Konishi, N.³

6
- 33645329282
- Post chemical-mechanical planarization defect study on 90nm Cu/low k interconnect
- H. H. Lu, H. H. Kuo, T. C. Tseng, Y. H. Chen, S. M. Jang, and M. S. Liang, post Chemical-Mechanical planarization Defect Study on 90nm Cu/Low k Interconnect, (2003), Proceedings of 2003 CMP-MIC Conference, pp240-244
- (2003) Proceedings of 2003 CMP-MIC Conference , pp. 240-244
- Lu, H.H.¹ Kuo, H.H.² Tseng, T.C.³ Chen, Y.H.⁴ Jang, S.M.⁵ Liang, M.S.⁶

7
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- Corrosion issues in chemical mechanical planarization for copper
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- Raghavan, S.¹ Tamilmani, S.² Huang, W.³ Small, R.⁴

8
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- Issues associated with cleaning of nano-sized particles
- W. Fyen, G. Vereecke, K. Xu, J. Lauerhaas, F. Holsteyns, R. Vos, and P. W. Mertens, Issues associated with cleaning of nano-sized particles, (2003), Proceedings of 2003 CMP-MIC Conference, pp334-343
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- Fyen, W.¹ Vereecke, G.² Xu, K.³ Lauerhaas, J.⁴ Holsteyns, F.⁵ Vos, R.⁶ Mertens, P.W.⁷

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.