Theoretical and experimental study on junction temperature of packaged Fabry-Perot laser diode

IEEE Transactions on Device and Materials Reliability

Volumn 4, Issue 2, 2004, Pages 292-294

  Han, Jae Ho ^a   Park, S W ^a  

^a LG   (South Korea)

Author keywords

Laser reliability; Laser thermal factors; Semiconductor device packaging; Semiconductor lasers

Indexed keywords

ELECTRIC CURRENT CONTROL; HEAT RESISTANCE; INTERPOLATION; OHMIC CONTACTS; OPTOELECTRONIC DEVICES; PACKAGING; QUANTUM EFFICIENCY; RELIABILITY; SEMICONDUCTOR DEVICES; THERMAL CONDUCTIVITY;

JUNCTION TEMPERATURE; LASER RELIABILITY; LASER THERMAL FACTORS; SEMICONDUCTOR DEVICE PACKAGING;

SEMICONDUCTOR LASERS;

EID: 4043115574     PISSN: 15304388     EISSN: None     Source Type: Journal    
DOI: 10.1109/TDMR.2004.827834     Document Type: Article

References (7)

1. M. Fukuda and G. Iwane, "Degradation of active region in InGaAsP/ InP buried heterostructure laser," J. Appl. Phys., vol. 58, pp. 2932-2936, 1985.
2. M. Fukuda, F. Kano, T. Kurosaki, and J. Yoshida, "Reliability and degradation behavior of highly coherent 1.55-μm long-cavity multiple quantum well (MQW) DFB lasers," J. Lightwave Technol., vol. 10, pp. 1097-1104, Aug. 1992.
3. "Generic reliability assurance requirements for optoelectronic devices used in telecommunications equipment," Bellcore, GR-468-CORE, 1998.
4. Y. Suematsu and A. R. Adams, Handbook of Semiconductor Laser and Photonic Integrated Circuits, London, U.K.: Chapman & Hall, 1994, pp. 98-99.
5. W. Nawaski, "Thermal conductivity of binary, ternary, and quaternary III-V compounds," J. Appl. Phys., vol. 64, pp. 159-166, 1988.
6. M. Guden and J. Peprek, "Material parameters of quaternary III-V semiconductors for multiplayer mirrors at 1.55 μm wavelength," Modeling Simul. Mater. Sci. Eng., vol. 4, pp. 349-357, 1996.
7. S. W. Park, C. K. Moon, J. H. Kang, Y. K. Kim, E. H. Hwang, B. J. Koo, D. Y. Kim, and J. I. Song, "Overgrowth on InP corrugations for 1.55 μm DFB LD's by reduction of carrier gas flow in LPMOCVD," J. Crystal Growth, vol. 258, pp. 26-33, 2003.