Post Cu CMP surface modification for reliability improvement in 300mm CLN90 BEOL Cu/low-k interconnect

Advanced Metallization Conference (AMC)

Volumn , Issue , 2003, Pages 433-437

  Chou, T J ^a   Wu, Z C ^a   Huang, Y L ^a   Lin, S H ^a   Chang, W ^a   Jang, S M ^a   Liang, M S ^a  

^a TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CMOS INTEGRATED CIRCUITS; ELECTROMIGRATION; ELLIPSOMETRY; ETCHING; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; REFRACTIVE INDEX; SURFACE ROUGHNESS; X RAY PHOTOELECTRON SPECTROSCOPY;

DAMASCENE INTERCONNECTS; DIFFUSION BARRIERS; HYDROPHOBIC BONDS; INTERMETAL DIELECTRIC INTERCONNECTS (IMD);

DIELECTRIC FILMS;

EID: 4043099160     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)

1. J. Noguchi, et al., IEEE Transactions on Electron Devices, vol. 48, pp. 1340, 2001.
2. A. Glasow, et al., IRPS 2003, 3A.2.