Development of an electroless nickel immersion gold process for PCB final finishes

Circuit World

Volumn 30, Issue 3, 2004, Pages 37-42

  Kwok, R W M ^a   Chan, K C M ^a   Bayes, M W ^b  

^a Rohm and Haas Electronic Materials Asia Limited   (Hong Kong)

^b ROHM AND HAAS COMPANY   (United States)

Author keywords

Metallizing; Porosity; Printed circuit boards

Indexed keywords

EID: 84986037941     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056120410520605     Document Type: Article

References (6)

1. Biunno, N. and Barbetta, M. (1999), “A root cause failure mechanism for solder joint integrity of electroless nickel/immersion gold surface finishes”, IPC EXPO Conference Proceeding, Long Beach, CA, pp. S18-5-1-S18-5-8.
2. Cordes, F. and Huemoeller, R. (1999), “Electroless nickel-gold: is there a future? Electroless Ni/Au plating capability study of BGA packages”, IPC EXPO Conference Proceeding, Long Beach, CA, pp. S13-1-1-S13-1-6.
3. Mallory, G.O. and Hajdu, J.B. (1990), “Electroless plating: fundamentals and applications”, AESF, Orlando, FL, pp. 57-74 and 118-124.
4. Mike, W. (2001), “Electroless nickel immersion gold and black pad”, Circuitree, pp. 10-16.
5. Milad, G. and Martin, J. (2000), “Electroless nickel/immersion gold, solderability and solder joint reliability as functions of process control”, Circuitree, pp. 56-62.
6. Riedel, W. (1998), “Electroless nickel plating”, ASM International, Finishing Publications LTD, pp. 33-63.