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Volumn , Issue , 2006, Pages

An integrated magnetic sensor with two continuous-time AE-converters and stress compensation capability

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; ENERGY GAP; FREQUENCY CONVERTERS; INTEGRATED CIRCUITS; SENSITIVITY ANALYSIS; TEMPERATURE CONTROL;

EID: 39749200330     PISSN: 01936530     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (21)

References (4)
  • 1
    • 28144439225 scopus 로고    scopus 로고
    • van der Meer, et al, A Fully Integrated CMOS Hall Sensor with a 3.65μT 3σ Offset for Compass Applications, ISSCC Dig. Tech. Papers, pp. 246-247, Feb., 2005.
    • van der Meer, et al, "A Fully Integrated CMOS Hall Sensor with a 3.65μT 3σ Offset for Compass Applications," ISSCC Dig. Tech. Papers, pp. 246-247, Feb., 2005.
  • 2
    • 0036504357 scopus 로고    scopus 로고
    • A 1.8-V AE Modulator Interface for an Electret Microphone with On-Chip Reference
    • Mar
    • O. Bajdechi and J.H Huijsing, "A 1.8-V AE Modulator Interface for an Electret Microphone with On-Chip Reference," IEEE J. Solid-State Circuits, vol. 37, pp. 279-285, Mar., 2002.
    • (2002) IEEE J. Solid-State Circuits , vol.37 , pp. 279-285
    • Bajdechi, O.1    Huijsing, J.H.2
  • 3
    • 0037480165 scopus 로고    scopus 로고
    • Minimization of the Mechanical-Stress-Induced Inaccuracy in Bandgap Voltage References
    • Jul
    • F. Fruett, G.C.M Meijer and A.Bakker, "Minimization of the Mechanical-Stress-Induced Inaccuracy in Bandgap Voltage References," IEEE J. Solid-State Circuits, vol. 38, pp. 1288-1291, Jul., 2003.
    • (2003) IEEE J. Solid-State Circuits , vol.38 , pp. 1288-1291
    • Fruett, F.1    Meijer, G.C.M.2    Bakker, A.3
  • 4
    • 27944462267 scopus 로고    scopus 로고
    • Drift of Magnetic Sensitivity of Smart Hall Sensors Due to Moisture Absorbed by the IC-Package
    • Oct
    • U. Ausserlechner, M. Motz and M.Holliber, "Drift of Magnetic Sensitivity of Smart Hall Sensors Due to Moisture Absorbed by the IC-Package," Proc. IEEE Sensors, vol. 1, pp. 455-458, Oct. 2004.
    • (2004) Proc. IEEE Sensors , vol.1 , pp. 455-458
    • Ausserlechner, U.1    Motz, M.2    Holliber, M.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.