Materials science: The cutting edge of plasma etching

Science

Volumn 319, Issue 5866, 2008, Pages 1050-1051

  Lill, Thorsten ^a   Joubert, Olivier ^b  

^a APPLIED MATERIALS INC   (United States)

^b CNRS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMISTRY; PHYSICS; PLASMA;

MATERIALS TESTING; PATTERN GENERATOR; PLASMA; PLASMA ETCHING; PRIORITY JOURNAL; PROCESS DESIGN; PROCESS TECHNOLOGY; REPRODUCIBILITY; SHORT SURVEY; SURFACE PROPERTY;

EID: 39749113753     PISSN: 00368075     EISSN: 10959203     Source Type: Journal    
DOI: 10.1126/science.1153901     Document Type: Short Survey

References (3)

1. R. Ramos et al., Thin Solid Films 515, 4846 (2007).
2. J. Coburn, H. Winters, J. Appl. Phys. 50, 3189 (1979).
3. We thank M. Oswald for the calculation of trench length on a wafer.