Advanced power SiP with wireless bonding for voltage regulators

Proceedings of the International Symposium on Power Semiconductor Devices and ICs

Volumn , Issue , 2007, Pages 125-128

  Hashimoto, T ^a   Uno, T ^b   Satou, Y ^b   Shiraishi, M ^a   Kawashima, T ^a   Matsuura, N ^b  

^a HITACHI LTD   (Japan)

^b RENESAS TECHNOLOGY CORP   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC RESISTANCE; ENERGY DISSIPATION; HEAT RESISTANCE; MOSFET DEVICES; SCHOTTKY BARRIER DIODES; VOLTAGE REGULATORS;

PACKAGE RESISTANCE; WIRELESS BONDING;

CHIP SCALE PACKAGES;

EID: 39749102871     PISSN: 10636854     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISPSD.2007.4294948     Document Type: Conference Paper

References (5)

1. M. Shiraishi, et al., "Low Loss and Small SiP for DC-DC Converters", ISPSD Proceedings, May 2005, pp. 175-178.
2. Y. Kawaguchi, et al., "Multi Chip Module with Minimum Parasitic Inductance for New Generation Voltage Regulator", ISPSD Proceedings, May 2005, pp. 371-374.
3. M. Darwish, et al., "A New Power W-Gated Trench MOSFET (WMOSFET) with High Switching Performance", ISPSD Proceedings, April 2003, pp. 24-27.
4. S. Ono, et al., "High density MOSBD (UMOS with built-in Trench Schottky Barrier Diode) for Synchronous Buck Converters", ISPSD Proceedings, June 2006, pp. 77-80.
5. P. Hazucha, et al., "A 233-MHz 80%-87% Efficient Four-Phase DC-DC Converter Utilizing Air-Core Inductors on Package", IEEE J. Solid-State Circuits, vol. 40, no. 4, Apr 2005, pp 838-845.