Building EWOD microfluidic array technology on top of foundry CMOS

Institution of Engineering and Technology Seminar on MEMS Sensors and Actuators, ICEPT

Volumn , Issue , 2006, Pages 23-30

  Li, Y ^a   Li, P ^a   Kazantzis, A ^a   Haworth, L I ^a   Muir, K ^a   Ross, A W S ^a   Terry, J G ^a   Stevenson, J T M ^a   Gundlach, A M ^a   Bunting, A ^a   Walton, A J ^a  

^a UNIVERSITY OF EDINBURGH   (United Kingdom)

Author keywords

CMOS; Electrowetting; Post processing

Indexed keywords

CHIP DESIGNS; CMOS; CMOS PROCESSING; CONTROL ELECTRODES; DIELECTRIC THICKNESSES; DRIVE VOLTAGES; DROPLET MOTION; DROPLET SIZES; ELECTRODE ARRAYS; ELECTROWETTING; ELECTROWETTING-ON-DIELECTRIC; FOUNDRY TECHNOLOGY; HIGH VOLTAGES; LIQUID DROPLETS; MEMS SENSORS; MICRO-FLUIDIC; MICROFLUIDIC PACKAGING; ON CHIPS; POST-PROCESSING;

ACTUATORS; CHIP SCALE PACKAGES; COMPOSITE MICROMECHANICS; DIELECTRIC DEVICES; DROP FORMATION; DROPS; ELECTRODES; ELECTROLYSIS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; FLUID MECHANICS; FOUNDRIES; FOUNDRY PRACTICE; INTEGRATED CIRCUITS; MEMS; METALLIZING; MICROELECTROMECHANICAL DEVICES; MICROELECTRONICS; MICROSENSORS; NANOFLUIDICS; OPTICAL DESIGN; PHOTORESISTS; SENSORS;

TECHNOLOGY;

EID: 39549102064     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

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