Effect of a finite quadruple junction mobility on grain microstructure evolution: Theory and simulation

Acta Materialia

Volumn 56, Issue 5, 2008, Pages 1151-1164

  Barrales Mora, L A ^a   Mohles, V ^a   Shvindlerman, L S ^a,b   Gottstein, G ^a  

^a RWTH AACHEN UNIVERSITY   (Germany)

^b INSTITUTE OF SOLID STATE PHYSICS   (Russian Federation)

Author keywords

Grain growth; Grain boundary migration; Modeling; Simulation; Theory

Indexed keywords

COMPUTER SIMULATION; GRAIN BOUNDARIES; GRAIN GROWTH; SEMICONDUCTOR JUNCTIONS;

QUADRUPLE JUNCTION MOBILITY; QUADRUPLE JUNCTIONS;

MICROSTRUCTURAL EVOLUTION;

EID: 39149114736     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2007.11.013     Document Type: Article

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