Silicon micro machined hermetic packaging technology for optical subassemblies

Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS

Volumn , Issue , 2006, Pages 102-103

  Kilian, Arnd ^a   Hauffe, Ralf ^a   Winter, Marcus ^a   Runge, Patrick ^a   Kuhmann, Jochen ^a   Greisen, Christoffer Graae ^b   Weichel, Steen ^b   Shiv, Lior ^b   Heschel, Matthias ^b  

^a Hymite GmbH   (Germany)

^b Bldg 376   (Denmark)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; HERMETIC DEVICES; MICROMACHINING; PRECISION ENGINEERING; SILICON WAFERS;

HERMETIC OPTICAL SUBASSEMBLIES; RF-PERFORMANCES; WAFERSCALE ASSEMBLY;

OPTICAL SYSTEMS;

EID: 39049163422     PISSN: 10928081     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/LEOS.2006.278876     Document Type: Conference Paper

References (4)

1. C.G.Greisen et all, "Processing and Performance of Broadband Integrated Resistor Structures on non-Planar Topologies in Hermetic Silicon Enclosure with Vertical Micro Vias, ECTC 2006, paper #255
2. G.Elger et al, "Optical Leak Detection for Wafer Level Hermeticity Testing", 2004 IEEE/SEMI Int'l Electronics Manufacturing Technology Symposium
3. M.Winter et al, "Simplified Optical Coupling and Alignment Scheme for Cost Effective 10 Gbit/s TOSA Modules Based on Edge Emitters Hermetically Packaged in Micro-Machined Silicon Structures", OFC 2005.
4. M. Winter et al, "Application and RF Performance of Integrated Resistor Structures on Non-Planar Topologies in Micro-Machined Silicon Packages for Transmitter Optical Subassemblies", ECTC 2006, # 255