Dielectric properties of epoxy/clay nanocomposites -effects of curing agent and clay dispersion method

IEEE Transactions on Dielectrics and Electrical Insulation

Volumn 15, Issue 1, 2008, Pages 24-32

  Tagami, N ^a   Okada, M ^a   Hirai, N ^a   Ohki, Y ^a   Tanaka, T ^a   Imai, T ^b   Harada, M ^c   Ochi, M ^c  

^a WASEDA UNIVERSITY   (Japan)

^b TOSHIBA CORPORATION   (Japan)

^c KANSAI UNIVERSITY   (Japan)

Author keywords

Conductivity; Curing agent; Epoxy nanocomposite; Filler dispersion method; Permittivity; Space charge distribution

Indexed keywords

CLAY; DIELECTRIC PROPERTIES; DISPERSIONS; ELECTRIC CONDUCTIVITY; EPOXY RESINS; FILLERS;

CURING AGENT; EPOXY NANOCOMPOSITE; FILLER DISPERSION METHOD; SPACE CHARGE DISTRIBUTION;

NANOCOMPOSITES;

EID: 38949091043     PISSN: 10709878     EISSN: None     Source Type: Journal    
DOI: 10.1109/T-DEI.2008.4446733     Document Type: Article

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