Direct media exposure of MEMS multi-sensor systems using a potted-tube packaging concept

Sensors and Actuators, A: Physical

Volumn 142, Issue 1, 2008, Pages 398-404

  Hyldgård, Anders ^a   Birkelund, Karen ^a   Janting, Jakob ^b   Thomsen, Erik V ^a  

^a TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

^b DELTA Danish Electronics Light & Acoustics   (Denmark)

Author keywords

Direct exposure; Harsh environment; Multi sensor; Packaging; Potting

Indexed keywords

MEMS; MICROFABRICATION; PLASTICS FILLERS; POLYSTYRENES; SENSOR DATA FUSION;

DIRECT MEDIA EXPOSURE; HARSH ENVIRONMENT; PACKAGING CONCEPTS; WATER CONDUCTIVITY;

ELECTRONICS PACKAGING;

EID: 38849113846     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2007.02.024     Document Type: Article

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