Fatigue behavior and damage characteristic of ultra-fine grain low-purity copper processed by equal-channel angular pressing (ECAP)

Materials Science and Engineering: A

Volumn 475, Issue 1-2, 2008, Pages 249-256

  Xu, Changzheng ^a   Wang, Qingjuan ^a   Zheng, Maosheng ^b   Li, Jindou ^a   Huang, Meiquan ^a   Jia, Qingming ^a   Zhu, Jiewu ^a   Kunz, Ludvik ^c   Buksa, Michal ^c  

^a XI'AN JIAOTONG UNIVERSITY   (China)

^b NORTHWEST UNIVERSITY   (China)

^c INSTITUTE OF PHYSICS OF MATERIALS   (Czech Republic)

Author keywords

Copper; ECAP; Fatigue behavior; Shear bands; Ultra fine grain structure

Indexed keywords

CRYSTAL MICROSTRUCTURE; DEFECTS; ELECTRON DIFFRACTION; EQUAL CHANNEL ANGULAR PRESSING; FATIGUE DAMAGE; STRESS-STRAIN CURVES; SURFACE MORPHOLOGY; TRANSMISSION ELECTRON MICROSCOPY;

CYCLIC SOFTENING; ELECTRON BACK SCATTERING DIFFRACTION;

COPPER ALLOYS;

COPPER ALLOYS; CRYSTAL MICROSTRUCTURE; DEFECTS; ELECTRON DIFFRACTION; EQUAL CHANNEL ANGULAR PRESSING; FATIGUE DAMAGE; STRESS-STRAIN CURVES; SURFACE MORPHOLOGY; TRANSMISSION ELECTRON MICROSCOPY;

EID: 38749132540     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2007.04.074     Document Type: Article

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