Design optimization and reliability of PWB level electronic package

Journal of Electronic Packaging

Volumn 129, Issue 1, 2007, Pages 9-18

  Hossain, Mohammad Masum ^a   Jagarkal, Sudhakar G ^a   Agonafer, Dereje ^a   Lulu, Menberu ^b   Reh, Stefan ^c  

^a University of Texas at Arlington   (United States)

^b UNIVERSITY OF PRETORIA   (South Africa)

^c ANSYS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEFORMATION; ELECTRIC POWER UTILIZATION; ENERGY DISSIPATION; FATIGUE OF MATERIALS; MICROFABRICATION; OPTICAL INTERCONNECTS; OPTIMIZATION; TEMPERATURE CONTROL;

ENVIRONMENTAL CHANGES; OPTIMIZATION INPUTS; OPTIMIZATION MODULE; SOLDER INTERCONNECTS; SUBAPPROXIMATION;

ELECTRONICS PACKAGING;

EID: 38749129094     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2429704     Document Type: Article

References (11)

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