Heat transfer behavior for a stationary or rotating MCM disk with an unconfined round jet impingement

Journal of Electronic Packaging

Volumn 129, Issue 4, 2007, Pages 400-410

  Fang, C J ^b   Wu, M C ^b   Kuo, Y M ^b   Lee, C Y ^b   Peng, C H ^b   Hung, Y H ^a,b  

^a ASME

^b NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; HEAT CONVECTION; HEAT FLUX; MULTICHIP MODULES; REYNOLDS NUMBER; TEMPERATURE DISTRIBUTION; TURBULENCE; VELOCITY CONTROL;

COMPOSITE CORRELATION; HEAT FLUX DISTRIBUTION; MULTICHIP MODULE (MCM) DISK;

FLOW OF FLUIDS;

EID: 38749127570     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2804087     Document Type: Article

References (12)

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