Transient convective heat transfer of air jet impinging onto a confined ceramic-based MCM disk

Journal of Electronic Packaging

Volumn 126, Issue 1, 2004, Pages 159-172

  Liu, Li Kang ^a   Su, Wen Shien ^a   Hung, Ying Huei ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BUOYANCY; CERAMIC MATERIALS; DISKS (MACHINE COMPONENTS); HEAT CONVECTION; INTEGRATED CIRCUITS; JETS; MICROPROCESSOR CHIPS; NOZZLES;

ELECTRONIC COMPONENTS; MAINFRAME COMPUTERS; MULTI-CHIP MODULE (MCM); TRANSIENT CONVECTIVE HEAT;

HEAT TRANSFER;

EID: 8744241331     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1649239     Document Type: Article

References (10)

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