Cobalt thin film deposited by remote plasma atomic layer deposition method using Cl2H10O6(CO)2 and CpCo(CO)2

Solid State Phenomena

Volumn 124-126, Issue PART 1, 2007, Pages 359-362

  Lee, Keunwoo ^a   Kim, Keunjun ^a   Jeong, Wooho ^a   Park, Taeyong ^a   Jeon, Hyeongtag ^a  

^a Hanyang University   (South Korea)

Author keywords

Cobalt; RPALD

Indexed keywords

ATOMIC LAYER DEPOSITION; AUGER ELECTRON SPECTROSCOPY; CHEMICAL VAPOR DEPOSITION; COBALT COMPOUNDS; PRESSURE EFFECTS;

PLASMA POWER; REMOTE PLASMA ATOMIC LAYER DEPOSITION METHOD;

THIN FILMS;

EID: 38549163830     PISSN: 10120394     EISSN: None     Source Type: Book Series    
DOI: 10.4028/3-908451-31-0.359     Document Type: Conference Paper

References (7)

1. S.P. Murarka, in : Suicides for VLSI Application, edtied by Academic Press, London (1983)
2. K. Maex : Mater. Sci. Eng. R. Vol.11 (1993), p. 53
3. T. Suntola, in : Handbook of Thin Film Process Technology, edtied by Institute of Physics, London (1995)
4. H. Jeon, J.W. Lee, Y.D. Kim, D.S. Kim and K.S. Yi : J. Vac, Sci. Technol. A, Vol. 18 (2000), p. 1595
5. H.Kim and S.M. Rossnagel : J. Vac. Sci. Technol. A, Vol. 20 (2002), p. 802
6. J.Y. Kim, Y. Kim and H. Jeon : Jpn. J. Appl. Phys. Vol. 42 (2003), p. L414
7. Information on http://web.phys.tue.nl