The new, new limits of optical lithography

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5374, Issue PART 1, 2004, Pages 1-8

  Mack, Chris A ^a,b  

^a KLA TENCOR CORPORATION   (United States)

^b KLA Tencor Austin   (United States)

Author keywords

Optical Lithography; Resolution Enhancement; Resolution Limits

Indexed keywords

NEXT GENERATION LITHOGRAPHY (NGL); RESOLUTION ENHANCEMENT; RESOLUTION LIMITS; SEMICONDUCTOR PATTERNING;

COST EFFECTIVENESS; INTEGRATED CIRCUIT MANUFACTURE; OPTICAL RESOLVING POWER; PHASE SHIFT; PROCESS CONTROL; SCANNING ELECTRON MICROSCOPY; THERMODYNAMIC STABILITY; THROUGHPUT;

PHOTORESISTS;

EID: 3843152670     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.546201     Document Type: Conference Paper

References (9)

1. C. A. Mack, "Pitch: The Other Resolution," Microlithography World (Summer 1998), pp. 23-24.
2. C. A. Mack, "Depth of Focus," Microlithography World (Spring 1995), pp. 20-21.
3. C. A. Mack, "Depth of Focus, part 2," Microlithography World (Autumn 1995), pp. 23-24.
4. C. A. Mack, "Resolution," Microlithography World (Winter 1997), pp. 16-17.
5. C. A. Mack, "Process Settings and Process Latitude," Microlithography World (August 2002).
6. C. A. Mack, "Resolution Enhancement Technologies," Microlithography World (May 2003).
7. C. A. Mack, "Off-Axis Illumination," Microlithography World (August 2003).
8. C. A. Mack, "Scattering Bars," Microlithography World (November 2003).
9. C. A. Mack and J. D. Byers, "Exploring the Capabilities of Immersion Lithography Through Simulation," Optical Microlithography XVII, Proc., SPE Vol. 5377 (2004).