Thermal and load-deflection FE analysis of parylene diaphragms

2002 International Conference on Modeling and Simulation of Microsystems - MSM 2002

Volumn , Issue , 2002, Pages 210-213

  Sim, Wonchul ^a   Kim, Byungkyu ^b   Choi, Bumkyoo ^c   Park, Jong Oh ^a  

^a Intelligent Microsystem Center   (South Korea)

^b Korea Institute of Science and Technology   (South Korea)

^c Sogang University   (South Korea)

Author keywords

Corrugated diaphragm; Load deflection; Parylene; Residual stress

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; MEMBRANES; PARAMETER ESTIMATION; PRESSURE EFFECTS; RESIDUAL STRESSES; SENSITIVITY ANALYSIS; STIFFNESS; THERMAL EXPANSION;

CORRUGATED DIAPHRAGM; LOAD-DEFLECTION; PARYLENE; THERMAL PROCESS;

DIAPHRAGMS;

EID: 3843148522     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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4. K.H. Kim and S.S. Yang, "Fabrication and test of an electromagnetic micro actuator with a planar coil on a parylene diaphragm," Proceeding MEMS, ASME Int. Mech. Eng., 2000.
5. W.C. Sim et al., "Fabrication, Test and Simulation of a Parylene diaphragm," Transducers '01 Eurosensors XV, Munich, Germany, 1382-1382, 2001.
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