Influence of fillet height of a low modulus die attach on the wirebondability of a plastic package

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 1998, Pages 291-295

  Rasiah, Ignatius J ^a   Leong, W S ^a  

^a Johnson Matthey (S) Pte Ltd   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

DIES; ELECTRONICS INDUSTRY; PLASTICS MOLDING;

DIE ATTACH MATERIALS; DYNAMIC MECHANICAL ANALYZERS (DMA);

ELECTRONICS PACKAGING;

EID: 0032230839     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (7)